전영화전(주)

Facility

> Facility > Ansan Plant

SPL (Special Plating Line) Information

Plating Line	Roll to roll continuous plating line	Material Thickness	Facility capable of ultra thin foil plating under 20 µm
Plating Types	Corrosion resistant plating, Ni plating	Width	550mm max.
Purposes	Electromagnetic field covering and heat resistant sheet	Line speed	10 ~ 20mpm
Monthly Average Production Capacity (Corrosion Resistant Plating)	350,000m(15m/min)	Monthly Average Production Capacity (Ni Plating)	250,000m(10m/min)

Monthly Average Production Capacity (Ni Plating)

Pretreatment: Divided into the degreasing process for removing rolled oil and impurities from the surface of the raw material before plating,
and acid-activation process for activating the surface by removing the thin oxidized layer from the surface of the metal

Plating: Electric plating line capable of multiple layer alloy plating of Ni, Zn and Sn to satisfy customer needs

Post-treatment: After the corrosion resistant plating process for improving the corrosion resistant property of plated foil, product is completed by drying in the oven.

Characteristics of SPL Plating

Corrosion resistant plating agent

Composed of multiple alloy plating layers, cover electromagnetic fields from electronic devices, used as heat resistant sheet
Ni plating agent

Capable of Ni plating of various thicknesses, and is used as ingredient for various electronic devices

Characteristics of plating foil

Corrosion resistance: Multiple layers of functional alloy foil are formed for high resistance to corrosion resulting in superior performance in various corrosion prone environments.

Heat resistant property: Due to the functional plating layer overcoming the thermal disadvantage of the material, the product is maintained without thermal deformation at high temperature.

Uniformity: Produced from continuous process in roll to roll line capable
of covering wide width, for simplified process and uniform quality.

SPL Product Purposes

Absorber(EMI Shielding) · Thermal Spread Sheet · Conductive Tape · EMI Gasket

PTC (Positive Temperature Coefficient) Information

Plating line	Roll to roll continuous plating line	Material	Electro deposited copper foil (ED copper foil)
Line speed	4 ~ 7mpm	Plating	Ni plating
CAPA Monthly average production capacity	200,000m	Purpose	PTC element

PTC Plating Process

Un-winder
(Cu foil)
Pre
treatment
Ni plating
Re-winder
(Ni plated Cu foil)
Re-winder
(Ni plated Cu foil)
Ni plating Cu foil slitting
Final
products

Characteristics of PTC Plating

Produce stable product with minimized interface resistance by maximizing the adhesion between polymer and nodule plated foil completed from special Ni plating process.
High Peel Strength
Excellent Low Resistance

Purposes of PTC Products

Radial PPTC
PPTC for disk
PPTC for strap

Printed circuit board
Cylindrical secondary battery
Rectangular secondary battery

MPL (Multi Plating Line) Information

Material	STS, Cu, Phosphor, Al, Steel plate	Length	1,000 ~ 6,000m
Thickness of raw material	30 ~ 500µm	Line speed	Max.15mpm
Width	Max. 340mm	Plating thickness	0.3~5µm
Plating types	Ni, Ag, Sn

MPL Plating Process

Advantages of roll to roll continuous plating

Uniformity: Product characteristics are uniformly maintained after producing in uniform conditions along the line moving at uniform speed.

Stability: Production conditions are controlled by automatic facility, hence enabling continuous and stable production

Continuity: Materials bound onto the roll are produced in uniform conditions, hence continuity of uniformity from beginning to end is maintained by implementing plating thickness, particle size and morphology.

이용약관

해당 홈페이지에 맞는 회원가입약관을 입력합니다.

Personal information handling policy

해당 홈페이지에 맞는 개인정보취급방침을 입력합니다.

Refuse illegal collection of email address

Illegal collection of email address is refused.

Notice that illegal collection of email address posted on this website by means of electronic mail address collection program or other technical devices is prohibited and is subject to criminal punishment according to information communications network act.

Sitemap